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ISL29028A
Typical Circuit
A typical application for the ISL29028A is shown in Figure 5. The
ISL29028A’s I 2 C address is internally hardwired as
0b100010<x>, with x representing the logic state of input I 2 C
address pin ADDR0. The device can be tied onto a system’s I 2 C
bus together with other I 2 C compliant devices.
Soldering Considerations
Convection heating is recommended for reflow soldering; direct-
infrared heating is not recommended. The plastic ODFN package
does not require a custom reflow soldering profile, and is qualified to
+260°C. A standard reflow soldering profile with a +260°C
maximum is recommended.
Suggested PCB Footprint
It is important that users check the “Surface Mount Assembly
Guidelines for Optical Dual FlatPack No Lead (ODFN) Package”
before starting ODFN product board mounting.
Layout Considerations
The ISL29028A is relatively insensitive to layout. Like other I 2 C
devices, it is intended to provide excellent performance even in
significantly noisy environments. There are only a few
considerations that will ensure best performance.
Route the supply and I 2 C traces as far as possible from all sources of
noise. A 0.1μF and 1μF power supply decoupling capacitors need to be
placed close to the device.
ALS Sensor Window Layout
Special care should be taken to ensure that the sensor, as
outlined in the sensor location outline, is uniformly illuminated.
Shadows that result from off angle window openings that affect
that uniform illumination can affect the measurement results.
V I2C_PULL-UP
R1
10k ?
R2
10k ?
R3
10k ?
I 2 C MASTER
MICROCONTROLLER
V DD
SLAVE_0
V IR-LED
SLAVE_1
I 2 C SLAVE_n
INT
SDA
SCL
1
ADDR0 IRDR
8
SDA
SDA
C1
1μF
C2
0.1μF
2
3
VDD
GND
INT
SDA
7
6
SCL
SCL
4
REXT
SCL
5
REXT
499k ?
ISL29028A
FIGURE 5. ISL29028A TYPICAL CIRCUIT
11
FN7721.3
January 29, 2014
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